TIM Dispensing Systems Built for Abrasive Materials
High-performance thermal interface materials demand equipment engineered for ceramic-filled fluids. We configure complete dispensing systems — pump, fluid path, agitation, temperature control — matched to your specific TIM and production requirements.
The Problem with Standard Dispensing Equipment on Abrasive TIMs
How hard a TIM is on equipment depends on its filler. Aluminum oxide (alumina), the most common TIM filler, is about 9 on the Mohs hardness scale, just below diamond at 10. At high filler loading, an alumina-filled TIM flowing through your system is essentially an abrasive slurry. Boron nitride (about 2) and zinc oxide (about 4.5) are much softer, so with those the bigger problem is usually settling rather than wear. Check the filler on your data sheet.
Standard stainless steel pumps, nozzles, and valve seats erode quickly under these conditions. Time-pressure systems lose shot weight accuracy as components wear. Heavy ceramic fillers migrate and settle, meaning the material dispensed at 8 a.m. has a different filler concentration — and different thermal conductivity — than material dispensed at 3 p.m.
The result is inconsistent bond line quality, unpredictable thermal performance, unplanned equipment downtime, and TIM you paid a premium for that isn't delivering the W/m·K value you specified.
Complete TIM Dispensing Systems, Configured for Your Material
We engineer systems around your specific TIM: filler type, specific gravity, viscosity, container format, and production volume.
Progressive Cavity Pumps
Solid tungsten carbide rotors in single and two-component configurations. Low-shear volumetric dispensing protects filler integrity and preserves the thermal conductivity you are paying for.
Integrated Agitation & Recirculation
Our material handling systems recirculate material continuously inside pails, cartridges, or drums. This prevents filler settlement and ensures homogeneous material from the first shot to the last.
Precise Temperature Control
Stabilizes process viscosity under ambient temperature fluctuations. Ensures consistent flow characteristics, precise bead dimensions, and repeatable bond line thicknesses.
Wear-Resistant Fluid Path
Tungsten carbide or hardened ceramic nozzles, abrasion-resistant lined hoses, and face-seal fittings. Every wetted component is specified to survive heavy filler loading.
Common Applications
- EV battery module assembly — gap filler dispensing for cell-to-module and module-to-pack thermal management; high-volume pail or drum configurations.
- Power electronics potting — IGBT, inverter, and power module encapsulation where voids are not acceptable.
- 5G infrastructure — base station and antenna electronics thermal management.
- High-performance computing — server and GPU thermal interface application.
- Semiconductor packaging — precision TIM application for chip-scale thermal management.
Configuration Specifications
| Parameter | Specification Range |
|---|---|
| TIM viscosity | 10,000 – 500,000+ cP |
| Filler loading handled | Up to 80% by volume |
| Container formats | 180 ml cartridge → 20 L pail → 55 gal drum |
| Pump technology | Progressive cavity (primary), piston/shot meter |
| Shot volume range | 0.01 ml – continuous bead |
| Temperature control | Ambient to 60 °C material conditioning |
| Dispensing platform | Benchtop, gantry robot, 6-axis integration |
*All systems are qualified on your specific material and process parameters before shipment.*
How We Work With You
Application Review
You share your TIM (datasheet + sample), substrate details, bond area geometry, shot size or bead length, and production volume target. We review the material chemistry and process requirements.
Equipment Recommendation
We specify pump technology, fluid path materials, agitation configuration, and dispense platform matched to your application. For unfamiliar TIMs, we run initial testing before finalizing configurations.
Process Qualification
We qualify the process on the actual production equipment using your material, from your container format. We establish baseline metrics and confirm shot weight accuracy and bead geometry meet your specifications.
Production Support
We provide wear monitoring guidance, preventative maintenance schedules, and component replacement recommendations specific to your material's abrasivity and production volume.
Discuss Your TIM Application
Whether you're specifying equipment for a new production line, troubleshooting wear or accuracy problems on an existing system, or scaling from prototype to production — we can help. Tell us your material, container format, and volume targets and we will recommend the right system.
Related Resources & Equipment
Which thermal interface materials do you dispense?
We have written a dispensing guide for each of the gap fillers, thermal gels, thermally conductive adhesives and potting compounds below: the material's published data, how we dispense it and the pump and feed system we recommend. Materials marked Tested have been sized and run on Dispense Robotics equipment.
3M
- 3M Thermally Conductive Epoxy Adhesive TC-2707 · 2K thermal adhesive, 0.72 W/m·K
- 3M Thermally Conductive Epoxy Adhesive TC-2810 · 2K thermal adhesive, 0.8–1.4 W/m·K
- 3M Thermally Conductive Grease TCG-2035 · thermal grease, 4.1 W/m·K
ACC Silicones
- QSil 553 thermally conductive encapsulant · 2K thermal potting compound · Tested
CHT
- SilSo Cool 15959 · 1K thermal adhesive, 2.7 W/m·K
- SilSo Cool 21005 · 2K gap filler, 3.68 W/m·K
- SilSo Cool 21012 · thermal potting, 1.3 W/m·K
- SilSo Cool 21311 · thermal potting, 2.3 W/m·K
Dow
- DOWSIL SE 4486 CV Thermally Conductive Adhesive · 1K thermal adhesive, 1.53 W/m·K · Tested
- DOWSIL TC-2035 CV Thermally Conductive Adhesive · 2K thermal adhesive, 3.3 W/m·K
- DOWSIL TC-3065 Thermal Gel · 1K thermal gel, 6.5 W/m·K
- DOWSIL TC-3120 Thermal Gel · 1K thermal gel, ~12 W/m·K
- DOWSIL TC-4025 Dispensable Thermal Pad · 2K gap filler (dispensable thermal pad), 2.5 W/m·K
- DOWSIL TC-4060 GB250 Thermal Gel · 2K thermal gel, 6 W/m·K
- DOWSIL TC-4515 Thermally Conductive Gap Filler · 2K gap filler, >1.5 W/m·K
- DOWSIL TC-4525 CV Thermally Conductive Gap Filler · 2K gap filler, 2.5 W/m·K · Tested
- DOWSIL TC-4535 CV Thermally Conductive Gap Filler · 2K gap filler, 3.4 W/m·K
- DOWSIL TC-5515 LT Low Density Thermally Conductive Gap Filler · 2K gap filler, 1.7 W/m·K
- DOWSIL TC-5533 Gap Filler · 2K gap filler, 3.0 W/m·K
- DOWSIL TC-5622 Thermally Conductive Compound · thermal grease, 4.3 W/m·K
- DOWSIL TC-6015 Thermal Conductive Encapsulant · thermal potting, 1.6 W/m·K
- SE4450 thermally conductive adhesive · 1K thermally conductive adhesive · Tested
- SE4485 thermal compound · 1K thermal compound · Tested
DuPont
- BETATECH 120D TIM · 1K gap filler · Tested
Electrolube
- ER6003 thermally conductive epoxy · 2K thermally conductive adhesive · Tested
- Electrolube ER2220 · thermal potting, 1.54 W/m·K
- Electrolube HTC (Heat Transfer Compound) · thermal grease, 0.9 W/m·K
- Electrolube HTCP (Heat Transfer Compound Plus) · thermal grease, 2.5 W/m·K
- Electrolube LGF400 · 2K gap filler, 4.0 W/m·K
- Electrolube TCOR · 1K thermal adhesive, 1.8 W/m·K
Fujipoly
- SARCON SPG-20B · 1K thermal gel (form-in-place), 2.1 W/m·K
- SARCON SPG-30B · 1K thermal gel (form-in-place), 3.1 W/m·K
- SARCON SPG-50A · 1K thermal gel (form-in-place), 5 W/m·K · Tested
- SARCON SPG-70A · 1K thermal gel (form-in-place), 7.0 W/m·K
H.B. Fuller
- EV Therm 288 · 2K gap filler, 2.1 W/m·K
- EV Therm 420 · 2K thermal adhesive, >1.0 W/m·K
- EV Therm 440 / 440GB · 2K thermal adhesive, >1.0 W/m·K
- EV Therm 441 / 441GB · 2K thermal adhesive, 1.0 W/m·K
Hala
- TAD-G-SI-1C thermal paste · 1K thermal compound · Tested
Henkel Bergquist
- BERGQUIST GAP FILLER TGF 1500 · 2K gap filler, 1.8 W/m·K
- BERGQUIST GAP FILLER TGF 2200 APS · 2K gap filler, 2.2 W/m·K
- BERGQUIST GAP FILLER TGF 3000SF · 2K gap filler, 3.0 W/m·K
- BERGQUIST GAP FILLER TGF 3010APS · 2K gap filler, 3.0 W/m·K
- BERGQUIST GAP FILLER TGF 3500LVO · 2K gap filler (low volatility), 3.5 W/m·K
- BERGQUIST GAP FILLER TGF 3600 · 2K gap filler, 3.6 W/m·K
- BERGQUIST GAP FILLER TGF 4000 · 2K gap filler, 4.0 W/m·K
- BERGQUIST GAP FILLER TGF 4400LVO · 2K gap filler (low volatility), 4.4 W/m·K
- BERGQUIST GAP FILLER TGF 4500CVO · 2K gap filler (controlled volatility), 4.5 W/m·K
- BERGQUIST LIQUI BOND TLB SA2000 (Liqui-Bond SA 2000) · 1K thermal adhesive, 2.0 W/m·K
- BERGQUIST LIQUI FORM TLF 10000 · 1K thermal gel, 10 W/m·K
- BERGQUIST LIQUI FORM TLF 6000HG · 1K thermal gel, 6.0 W/m·K
- BERGQUIST LIQUI FORM TLF LF2000 (Liqui-Form 2000) · 1K thermal gel, 2.0 W/m·K
- BERGQUIST LIQUI FORM TLF LF3500 (Liqui-Form 3500) · 1K thermal gel, 3.5 W/m·K
- BERGQUIST TGR 4000 (formerly TIC 4000) · thermal grease, 4.0 W/m·K
- Gap Filler 3500S35 · 2K gap filler, 3.6 W/m·K · Tested
Henkel Loctite
- LOCTITE TLB 9270APS · 2K thermal adhesive (EV battery), 2 W/m·K
- LOCTITE TLB 9300 APSi · 2K thermal adhesive (structural, EV battery), 3.2 W/m·K
Henkel
- Loctite SI 5404 thermal silicone · 1K gap filler · Tested
Kerafol
- KP 98 thermal paste · 1K thermal compound · Tested
Laird
- CR350 thermal gap filler · 2K gap filler · Tested
- Tflex CR350S · 2K gap filler, 3.6 W/m·K
- Tputty 403 · 1K dispensable gap filler, 2.3 W/m·K
- Tputty 506 gap filler · 1K thermal gel · Tested
- Tputty 508 · 1K dispensable gap filler, 3.7 W/m·K · Tested
- Tputty 607 · 1K dispensable gap filler, 6.4 W/m·K
- Tputty 607MF · 1K dispensable gap filler, 6.2 W/m·K
- Tputty 910 · 1K dispensable gap filler, 9.1 W/m·K
- Tputty SF560 · 1K dispensable gap filler, 5.6 W/m·K
Momentive
- SilCool TIA141GF · 1K thermal gel (pre-cured putty), 4.1 W/m·K
- SilCool TIA208RL · thermal potting, 0.6 W/m·K
- SilCool TIA2101GF · 2K gap filler, 10.1 W/m·K
- SilCool TIA211G · thermal potting, 1.1 W/m·K
- SilCool TIA216G · thermal potting, 1.6 W/m·K · Tested
- SilCool TIA225GF · 2K gap filler, 2.5 W/m·K · Tested
- SilCool TIA225GFB-25 · 2K gap filler, 2.5 W/m·K
- SilCool TIA227G · thermal potting, 2.6 W/m·K
- SilCool TIA241GF · 2K gap filler, 4.1 W/m·K
- SilCool TIA350R · 1K thermal adhesive, 3.5 W/m·K
- SilCool TIG3500H · thermal grease, 3.5 W/m·K
NuSil
- NuSil CV-2946 · 2K thermal adhesive, 1.49 W/m·K
- NuSil R-2930 · 2K thermal adhesive, 1.46 W/m·K
- NuSil R-2939 · 2K thermal adhesive, 0.75 W/m·K
Parker Chomerics
- THERM-A-GAP CIP 35E · 2K gap filler / cure-in-place, 3.5 W/m·K
- THERM-A-GAP CIP 60 · 2K gap filler / cure-in-place, 6.0 W/m·K
- THERM-A-GAP GEL 37 · 1K thermal gel, 3.7 W/m·K
- THERM-A-GAP GEL 45 · 1K thermal gel, 4.5 W/m·K
- THERM-A-GAP GEL 60HF · 1K thermal gel (high flow), 6.2 W/m·K
- THERM-A-GAP GEL 75 · 1K thermal gel, 7.5 W/m·K
- THERM-A-GAP GEL 8010 · 1K thermal gel, 3.0 W/m·K
- Therm-A-Gap Gel 30 · 1K thermal gel · Tested
Parker LORD
- CoolTherm EP-2000 · thermal potting / encapsulant, 1.9 W/m·K · Tested
- CoolTherm EP-3500 · thermal potting / encapsulant, 3.3 W/m·K
- CoolTherm SC-1200 · 2K gap filler, 2.0 W/m·K
- CoolTherm SC-1600 · 2K gap filler, 3.7 W/m·K
- CoolTherm SC-3000 LD · 2K gap filler, 3.0 W/m·K
- CoolTherm SC-320 · thermal potting / encapsulant, 3.0 W/m·K
- CoolTherm SC-324 · 2K thermally conductive silicone encapsulant, 4.0 W/m·K · Tested
- CoolTherm SC-3500 · 2K gap filler, 3.5 W/m·K
- CoolTherm TC-2002 · 2K thermal adhesive (structural), 1.0 W/m·K · Tested
- CoolTherm TC-404 · thermal grease, 4.3 W/m·K
- CoolTherm UR-2000 · 2K gap filler / thermal adhesive, 2 W/m·K
- CoolTherm UR-3000 · 2K gap filler, 3.2 W/m·K
Red Ice
- Red Ice 613 thermal compound · 1K thermal compound · Tested
Sekisui Polymatech
- CGW3 thermal gap filler · 2K gap filler · Tested
Shin-Etsu
- G-1000 · 1K gap filler (moisture cure), 2.40 W/m·K
- G-747 · thermal grease, 0.90 W/m·K
- G-751 · thermal grease, 4.50 W/m·K
- G-775 · thermal grease, 3.60 W/m·K
- G-776 · thermal grease, 1.30 W/m·K
- G-777 · thermal grease, 3.30 W/m·K
- G-779 · thermal grease, 3.00 W/m·K
- G-781 · 1K gap filler (heat cure), 2.60 W/m·K
- KE-1861 A/B · thermal potting, 0.83 W/m·K
- KE-1867 · 1K thermal adhesive, 2.00 W/m·K
- KE-1891 · 1K thermal adhesive, 4.00 W/m·K
- SDP-5040 A/B · 2K gap filler, 5.10 W/m·K
- X-23-8052 · thermal grease, 6.00 W/m·K
Sika
- SikaBiresin TC-455 · 2K gap filler, 2.2 W/m·K
- SikaFast-606 TC · 2K thermal adhesive, 1.6 W/m·K
- SikaForce-325 CB · 2K thermal adhesive, 1.2 W/m·K
- SikaForce-326 CB · 2K thermal adhesive, 1.2 W/m·K
- Sikaflex-961 TC · 2K thermal adhesive, 1.8 W/m·K
- Sikasil-961 TC · 2K gap filler, 2.0 W/m·K
Wacker
- ELASTOSIL RT 747 TC · thermal potting, 1.3 W/m·K
- ELASTOSIL RT 7612 AD TC · thermal potting, 1.3 W/m·K
- SEMICOSIL 961 TC A/B · 2K gap filler, 2.3 W/m·K
- SEMICOSIL 9649 TC · 2K gap filler, 3.6 W/m·K
- SEMICOSIL 9671 TC4 · 2K gap filler, 2.3 W/m·K
- SEMICOSIL 9673 TC A/B · 2K gap filler, 3.6 W/m·K
- SEMICOSIL 971 TC · 1K thermal adhesive, 2 W/m·K
- SEMICOSIL 9720 TC · 1K thermal adhesive, 1.9 W/m·K
- SEMICOSIL Paste 40 TC · thermal grease, 4.0 W/m·K
- WACKER Paste P12 · thermal grease, 0.81 W/m·K
Don't see your material? Send us the data sheet and we'll recommend a pump and feed system.
Product names are trademarks of their respective owners and are listed to describe materials our equipment dispenses. Listing does not imply endorsement by the manufacturer.